Zig-zag in-line package
The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages (TSOPs), but are still in use. The quad in-line package uses a similar staggered semiconductor package design.
High-power devices (such as high-voltage op-amp ICs, voltage regulators, and motor driver ICs) are still being manufactured in a package with a zig-zag pinout (and normally screwed onto a heatsink). These zig-zag packages include variations on the TO220 such as "TO220S", "staggered leads TO-220-11", "staggered leads TO-220-15", and HZIP. The trademarks Pentawatt or Hexawatt are also used for chips in multi-leaded power packages like TDA2002/2003/2020/2030 and L200.[1]
- ZIP chips in ZIP sockets
- ZIP chips
As for computers, dynamic RAM ZIP chips are now only to be found in obsolete computers, some of these are:
- Amiga 500 expansion packs
- Amiga 3000 on-board memory and some expansion boards
- Commodore CDTV on-board memory
- Acorn Archimedes 300 and 400 series on-board memory
- Acorn Archimedes A3010 and A3020
See also
- Types of chip carriers – list of chip package types
References
- ^ http://www.st.com/st-web-ui/static/active/en/resource/technical/document/datasheet/CD00000053.pdf [dead link]
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- SOT / TSOT
- TO-3 (TH / Panel)
- TO-5 (TH)
- TO-8 (TH)
- TO-18 (TH)
- TO-39 (TH)
- TO-66 (TH / Panel)
- TO-92 (TH)
- TO-126 (TH / Panel)
- TO-202 (TH / Panel)
- TO-220 (TH / Panel)
- TO-247 (TH / Panel)
- TO-251 (IPAK) (SMT)
- TO-252 (DPAK) (SMT)
- TO-262 (I2PAK) (SMT)
- TO-263 (D2PAK) (SMT)
- TO-268 (D3PAK) (SMT)
- TO-273 (Super-220) (SMT)
- TO-274 (Super-247) (SMT)
- DFN
- DIP / DIL
- Flat Pack
- MSOP
- SO / SOIC
- SOP / SSOP
- TSOP / HTSOP
- TSSOP / HTSSOP
- ZIP
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